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    Titel :

    Metallic wafer and chip bonding for led packaging



    Kongress:

    5th, Pacific Rim conference on lasers and electro-optics; photonics lights innovation: from nano-structures and devices to systems and networks ; 2003 ; Taipei, Taiwan



    Erscheinungsdatum :

    01.01.2003


    Format / Umfang :

    26 pages


    Anmerkungen:

    Includes bibliographic references and author index



    Medientyp :

    Aufsatz (Konferenz)


    Format :

    Print


    Sprache :

    Englisch




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