Multilayer polyimide film substrates for interconnections in microsystems
MICROSYSTEM TECHNOLOGIES ; 5 , 4 ; 166-168
01.01.1999
3 pages
Aufsatz (Zeitschrift)
Englisch
DDC: | 629.83 |
© Metadata Copyright the British Library Board and other contributors. All rights reserved.
Parallel Gap Welding Microelectronic Interconnections to Thin Film Substrates
SAE Technical Papers | 2011
Parallel Gap Welding Microelectronic Interconnections to Thin Film Substrates
SAE Technical Papers | 2017
PARALLEL GAP WELDING Microelectronic Interconnections To Thin Film Substrates
SAE Technical Papers | 1982
Interfacing Microsystems with Active Substrates
British Library Conference Proceedings | 1999
|PARALLEL GAP WELDING OF MICROELECTRONIC INTERCONNECTIONS TO THIN FILM SUBSTRATES
SAE Technical Papers | 1968