Multi-Step Bonding Cycles for Lowering Thermal Residual Stresses in Composite Patch Repairs
43rd AIAA/ASME/ASCE/AHS/ASC Structures, Structural Dynamics, and Materials Conference ; 2002 ; Denver , Colorado
01.01.2002
Aufsatz (Konferenz)
Elektronische Ressource
Englisch
Multi-Step Bonding Cycles for Lowering Thermal Residual Stresses in Composite Patch Repairs
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