The invention provides a molding and assembling method of an airborne electronic pod. The molding and assembling method comprises the following steps: 1, molding and assembling the airborne electronic pod; radome forming: adopting a skin honeycomb sandwich structure, and obtaining the radome through hot-pressing curing forming; shell forming: adopting a skin honeycomb sandwich structure, pre-embedding precast blocks in a local area, and performing hot-pressing curing forming to obtain a shell; and forming the electronic pod: positioning by using a tool through a molded surface and a hole site, and gluing and riveting the shell and the antenna housing to obtain the electronic pod. In addition, the invention further discloses the airborne light-weight electronic pod, and the airborne light-weight electronic pod is prepared by adopting the molding method. The airborne light-weight electronic pod is light in weight and good in consistency, and the manufacturing method of the airborne light-weight electronic pod is simple and convenient.

    本发明提供了一种机载电子吊舱的成型及装配方法,所述成型及装配方法包括以下步骤;天线罩成型:采用蒙皮蜂窝夹层结构,通过热压固化成型获得天线罩;壳体成型:采用蒙皮蜂窝夹层结构,局部区域采用预制块预埋,通过热压固化成型获得壳体;电子吊舱成型:利用工装通过型面、孔位定位,将壳体与天线罩通过胶接、铆接获得电子吊舱。此外,本发明还公开了一种机载轻量化电子吊舱,所述机载轻量化电子吊舱采用上述成型方法制备获得。本发明所述的机载轻量化电子吊舱质量轻、一致性佳,并且其制造方法较为简便。


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    Titel :

    Molding and assembling method of airborne electronic pod


    Weitere Titelangaben:

    机载电子吊舱的成型及装配方法


    Beteiligte:
    AI KAI (Autor:in) / WANG WEI (Autor:in) / WANG GUANGHUI (Autor:in) / WANG XING (Autor:in) / CHEN HAITAO (Autor:in) / LI LIANG (Autor:in) / TONG ZHEYI (Autor:in) / ZHANG YIWEI (Autor:in)

    Erscheinungsdatum :

    08.04.2025


    Medientyp :

    Patent


    Format :

    Elektronische Ressource


    Sprache :

    Chinesisch


    Klassifikation :

    IPC:    B29C Formen oder Verbinden von Kunststoffen , SHAPING OR JOINING OF PLASTICS / B64D Ausrüstung für Flugzeuge , EQUIPMENT FOR FITTING IN OR TO AIRCRAFT



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