PROBLEM TO BE SOLVED: To easily perform height adjustment for a unit of a CMP device.SOLUTION: A lifting device 630 includes: a plate 670 which supports an underside of at least one unit of a CMP device; a lifting mechanism 640 which is provided between a floor surface, on which the CMP device is located, and the plate 670, and can adjust the height of the unit with respect to the floor surface; a height adjustment grip 650 which is provided on the lifting mechanism 640; and an adjustment member 660 which can adjust the height of the lifting mechanism 640. The adjustment member 660 has a connection part 662 which is connected to the height adjustment grip 650, an extension part 664 which is extended from the connection part 662, and an operation part 666 which is provided on the extension part 664, and can adjust the height of the lifting mechanism 640 via the height adjustment grip 650 by operation for the operation part 666.
【課題】CMP装置のユニットの高さ調整を容易に行う。【解決手段】昇降装置630は、CMP装置の少なくとも1つのユニットの下面を支持するプレート670と、CMP装置を設置する床面とプレート670との間に設けられ、床面に対するユニットの高さを調整可能な昇降機構640と、昇降機構640に設けられた高さ調整用つまみ650と、昇降機構640を高さ調整可能な調整部材660と、を備える。調整部材660は、高さ調整用つまみ650に接続される接続部662、接続部662から延伸する延伸部664、及び延伸部664に設けられた操作部666を有し、操作部666に対する操作によって高さ調整用つまみ650を介して昇降機構640を高さ調整可能である。【選択図】図6
LIFTING DEVICE AND UNIT TRANSPORTATION METHOD
昇降装置、及び、ユニット搬送方法
24.11.2015
Patent
Elektronische Ressource
Japanisch
IPC: | B24B MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING , Maschinen, Einrichtungen oder Verfahren zum Schleifen oder Polieren / H01L Halbleiterbauelemente , SEMICONDUCTOR DEVICES / B66F HOISTING, LIFTING, HAULING, OR PUSHING, NOT OTHERWISE PROVIDED FOR, e.g. DEVICES WHICH APPLY A LIFTING OR PUSHING FORCE DIRECTLY TO THE SURFACE OF A LOAD , Hub-, Verhol- oder Schubvorrichtungen, soweit nicht anderweitig vorgesehen, z.B. Vorrichtungen mit unmittelbarer Krafteinwirkung auf die Last |
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