A molding method according to the embodiment includes the steps of: supplying a substrate and a core to a core insert unit; inserting the core into the substrate in the core insert unit; molding the substrate into which the core is inserted; cooling the molded substrate; degating the molded substrate; separating the core inserted into the substrate; and washing the separated core. The present invention is to provide the system and the method for efficient smart key production by automating an entire molding process for smart key production.

    본 실시예에 따른 몰딩 방법은 코어 인서트 유닛에 기판과 코어를 공급하는 단계; 상기 코어 인서트 유닛에서 상기 기판에 상기 코어를 삽입하는 단계; 상기 코어가 삽입된 상기 기판을 몰딩하는 단계; 몰딩된 상기 기판을 쿨링하는 단계; 몰딩된 상기 기판을 디게이팅 하는 단계; 상기 기판에 삽입된 상기 코어를 분리하는 단계; 및 분리된 상기 코어를 세척하는 단계를 포함한다.


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    Titel :

    SUBSTRATE MOLDING NETHOD AND MOLDING SYSTEM


    Weitere Titelangaben:

    기판 몰딩 방법 및 몰딩 시스템


    Beteiligte:
    YOO KIYOON (Autor:in) / YOON TAE HWAN (Autor:in)

    Erscheinungsdatum :

    11.10.2023


    Medientyp :

    Patent


    Format :

    Elektronische Ressource


    Sprache :

    Koreanisch


    Klassifikation :

    IPC:    B29C Formen oder Verbinden von Kunststoffen , SHAPING OR JOINING OF PLASTICS / B60R Fahrzeuge, Fahrzeugausstattung oder Fahrzeugteile, soweit nicht anderweitig vorgesehen , VEHICLES, VEHICLE FITTINGS, OR VEHICLE PARTS, NOT OTHERWISE PROVIDED FOR



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