A package which comprises a chip carrier, at least one electronic chip mounted on the chip carrier, an electrically conductive contact structure electrically coupled with the at least one electronic chip, and a mold-type encapsulant encapsulating part of the electrically conductive contact structure, and at least part of the chip carrier and of the at least one electronic chip, wherein the chip carrier comprises a thermally conductive and electrically insulating core covered on both opposing main surfaces thereof by a respective brazed electrically conductive layer.


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    Titel :

    Molded package with chip carrier comprising brazed electrically conductive layers


    Beteiligte:
    PAVIER MARK (Autor:in) / HABLE WOLFRAM (Autor:in) / KESSLER ANGELA (Autor:in) / SIELAFF MICHAEL (Autor:in) / PUGATSCHOW ANTON (Autor:in) / RIMBERT-RIVIERE CHARLES (Autor:in) / SOBKOWIAK MARCO (Autor:in)

    Erscheinungsdatum :

    11.09.2018


    Medientyp :

    Patent


    Format :

    Elektronische Ressource


    Sprache :

    Englisch


    Klassifikation :

    IPC:    H01L Halbleiterbauelemente , SEMICONDUCTOR DEVICES / B60R Fahrzeuge, Fahrzeugausstattung oder Fahrzeugteile, soweit nicht anderweitig vorgesehen , VEHICLES, VEHICLE FITTINGS, OR VEHICLE PARTS, NOT OTHERWISE PROVIDED FOR



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