A capacitor module that suppresses the occurrence of solder cracking includes a substrate having a first principal surface and a second principal surface opposite to each other in a thickness direction, and capacitor elements mounted on at least the first principal surface of the substrate, wherein the substrate has a first pad electrode solder-bonded to a first terminal electrode provided at one end side of the capacitor elements and a second pad electrode solder-bonded to a second terminal electrode provided at the other end side of the capacitor elements, and penetrating holes are provided at positions, which overlap a pair of boundary lines that define a boundary between at least a region between the first pad electrode and the second pad electrode and an outside of the region in a plan view, and pass through the substrate in the thickness direction.
Capacitor module, resonator, wireless power transmission device, wireless power reception device, and wireless power transmission system
29.12.2020
Patent
Elektronische Ressource
Englisch
IPC: | H05K PRINTED CIRCUITS , Gedruckte Schaltungen / H02J CIRCUIT ARRANGEMENTS OR SYSTEMS FOR SUPPLYING OR DISTRIBUTING ELECTRIC POWER , Schaltungsanordnungen oder Systeme für die Abgabe oder Verteilung elektrischer Leistung / H01G Kondensatoren , CAPACITORS / B60L PROPULSION OF ELECTRICALLY-PROPELLED VEHICLES , Antrieb von elektrisch angetriebenen Fahrzeugen / H03H IMPEDANCE NETWORKS, e.g. RESONANT CIRCUITS , Scheinwiderstandsnetzwerke, z.B. Resonanzkreise |
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