An electronic device includes: a wiring board; an electric connection wiring connected to a power supply; motor connection wirings arranged on a peripheral side of the wiring board and connected to the electric motor; and semiconductor modules having semiconductor elements and a resin mold. The semiconductor modules are arranged at a position on the electric connection wiring or on the peripheral side of the electric connection wiring and on a center side of the motor connection wiring. At least a part of electrodes of the plurality of semiconductor modules is mounted on the electric connection wiring.


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    Titel :

    Electronic device comprising semiconductor module


    Beteiligte:
    MIYACHI SYUHEI (Autor:in) / SAITOU ATSUSHI (Autor:in) / FUJITA TOSHIHIRO (Autor:in) / NAGASE NOBORU (Autor:in)

    Erscheinungsdatum :

    03.12.2024


    Medientyp :

    Patent


    Format :

    Elektronische Ressource


    Sprache :

    Englisch


    Klassifikation :

    IPC:    H05K PRINTED CIRCUITS , Gedruckte Schaltungen / H02K Dynamoelektrische Maschinen , DYNAMO-ELECTRIC MACHINES / B62D MOTOR VEHICLES , Motorfahrzeuge



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