A metal mold that is used has a penetration hole in which a wiring bundle is to be penetratingly disposed, an annular retention portion-molding space for surrounding the outer circumference of the wiring bundle, and an engagement portion-molding space communicatively connected with the retention portion-molding space. The wiring bundle is disposed in the penetration hole, a melt resin is poured in the retention portion-molding space from the engagement portion-molding space, and solidified through cooling to mold a retention portion integrally with a engagement portion in a state of being closely adhered to an outer circumference of the wiring bundle.
METHOD FOR MANUFACTURING WIRE HARNESS, WIRE HARNESS MANUFACTURING DEVICE, WIRE HARNESS, AND RETENTION COMPONENT
29.09.2016
Patent
Elektronische Ressource
Englisch
IPC: | B05D PROCESSES FOR APPLYING LIQUIDS OR OTHER FLUENT MATERIALS TO SURFACES, IN GENERAL , Verfahren zum Aufbringen von Flüssigkeiten oder von anderen fließfähigen Stoffen auf Oberflächen allgemein / B60R Fahrzeuge, Fahrzeugausstattung oder Fahrzeugteile, soweit nicht anderweitig vorgesehen , VEHICLES, VEHICLE FITTINGS, OR VEHICLE PARTS, NOT OTHERWISE PROVIDED FOR |
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