A MEMS chip assembly includes: a support structure having a chip mounting surface; a MEMS chip mounted on the chip mounting surface, the MEMS chip having an active surface including one or more rows of MEMS devices and a row of bond pads disposed alongside a connection edge of the MEMS chip and parallel with the rows of MEMS devices; electrical connectors connected to the bond pads; and an encapsulant material covering the electrical connectors. The MEMS chip has a plurality of trenches defined in the active surface, the trenches extending parallel with the rows of MEMS devices and disposed between the bond pads and the MEMS devices. The encapsulant material does not encroach past the trenches towards the MEMS devices.


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    Titel :

    MEMS CHIP ASSEMBLY HAVING MULTIPLE TRENCHES


    Beteiligte:
    PEREZ ELMER DIMACULANGAN (Autor:in) / NORTH ANGUS (Autor:in) / LOWE GRAEME (Autor:in) / TAN SEE-HUAT (Autor:in) / BARTON CHRISTOPHER (Autor:in)

    Erscheinungsdatum :

    04.03.2021


    Medientyp :

    Patent


    Format :

    Elektronische Ressource


    Sprache :

    Englisch


    Klassifikation :

    IPC:    G05D SYSTEMS FOR CONTROLLING OR REGULATING NON-ELECTRIC VARIABLES , Systeme zum Steuern oder Regeln nichtelektrischer veränderlicher Größen / B64C AEROPLANES , Flugzeuge



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