A monolithic integrated proximity sensor device includes a semiconductor substrate with an active surface with at least one active or passive component or bond pad; an interconnection stack having a plurality of at least two metal layers; at least a first transmitter coil having a first spiral course with at least three turns formed in at least one or at least two metal layers and defining the first region having a first inner and outer periphery; at least a first receiver coil having a second spiral course with at least three turns formed in at least one or at least two metal layers and defining a second region having a second inner and outer periphery. At least one component or bond pad is located inside the first or second inner periphery.
PROXIMITY SENSOR DEVICE AND SYSTEM
03.03.2022
Patent
Elektronische Ressource
Englisch
IPC: | H01L Halbleiterbauelemente , SEMICONDUCTOR DEVICES / H10N / G01D MEASURING NOT SPECIALLY ADAPTED FOR A SPECIFIC VARIABLE , Anzeigen oder Aufzeichnen in Verbindung mit Messen allgemein / B60R Fahrzeuge, Fahrzeugausstattung oder Fahrzeugteile, soweit nicht anderweitig vorgesehen , VEHICLES, VEHICLE FITTINGS, OR VEHICLE PARTS, NOT OTHERWISE PROVIDED FOR |
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