A handling device is used for handling a substrate. The handling device includes a holder, a moving element, at least one first adhesive chuck, and at least one second adhesive chuck. The moving element is located adjacent to the holder for moving relative to the holder along a first axial direction. The first adhesive chuck is located on a first surface of the holder and the second adhesive chuck is located on a first surface of the moving element, in which the first adhesive chuck and the second adhesive chuck are used to be respectively separated from the substrate adhered thereon. In addition, another embodiment of the invention discloses a handing method of the handing device.


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    Titel :

    Handling device and handling method thereof


    Beteiligte:
    HSIEH WEI-JUNG (Autor:in)

    Erscheinungsdatum :

    22.12.2015


    Medientyp :

    Patent


    Format :

    Elektronische Ressource


    Sprache :

    Englisch


    Klassifikation :

    IPC:    H01L Halbleiterbauelemente , SEMICONDUCTOR DEVICES / B66F HOISTING, LIFTING, HAULING, OR PUSHING, NOT OTHERWISE PROVIDED FOR, e.g. DEVICES WHICH APPLY A LIFTING OR PUSHING FORCE DIRECTLY TO THE SURFACE OF A LOAD , Hub-, Verhol- oder Schubvorrichtungen, soweit nicht anderweitig vorgesehen, z.B. Vorrichtungen mit unmittelbarer Krafteinwirkung auf die Last / B25J Manipulatoren , MANIPULATORS



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