Disclosed is a cooling system for a conversion device that includes a heat sinking plane, a main cooling jacket, and a sub-cooling jacket. The main cooling jacket is connected with the heat sinking plane and provided with a first component disposed thereto. The sub cooling jacket is connected with the heat sinking plane on the opposite side of the main cooling jacket, and provided with a second component which generates a relatively lower amount of heat than the first component. A main inlet is disposed in the main cooling jacket for supplying coolant to the main cooling jacket, and an outlet is disposed in the sub cooling jacket for exhausting the coolant which has passed through the sub cooling jacket. A sub inlet is formed in the heat sinking plane for the coolant passing through the main cooling jacket to be supplied to the sub cooling jacket.


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    Titel :

    Cooling system for power conversion device


    Beteiligte:
    JEON WOOYONG (Autor:in) / KIM JOON HWAN (Autor:in) / KIM MINJI (Autor:in)

    Erscheinungsdatum :

    12.12.2017


    Medientyp :

    Patent


    Format :

    Elektronische Ressource


    Sprache :

    Englisch


    Klassifikation :

    IPC:    H01L Halbleiterbauelemente , SEMICONDUCTOR DEVICES / H05K PRINTED CIRCUITS , Gedruckte Schaltungen / B60H ARRANGEMENTS OR ADAPTATIONS OF HEATING, COOLING, VENTILATING, OR OTHER AIR-TREATING DEVICES SPECIALLY FOR PASSENGER OR GOODS SPACES OF VEHICLES , Anordnung oder Einbau der Heizung, Kühlung, Lüftung oder anderer Luftbehandlungsvorrichtungen für die Fahrzeugräume für Reisende oder Fracht / F28D Wärmetauscher, soweit in keiner anderen Unterklasse vorgesehen, in denen die Wärmetauschmittel nicht in direkte Berührung miteinander kommen , HEAT-EXCHANGE APPARATUS, NOT PROVIDED FOR IN ANOTHER SUBCLASS, IN WHICH THE HEAT-EXCHANGE MEDIA DO NOT COME INTO DIRECT CONTACT



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