High-resolution micromachining of a range of materials (polymers, fused silica, silicon, diamond) has been investigated using both short wavelength (157 nm, F/sub 2/) and short (100 fsec, Ti:Al/sub 2/O/sub 3/) pulse laser radiation. Results using the two sources are compared.
High resolution micromachining using short wavelength and short pulse lasers
01.01.2001
300370 byte
Aufsatz (Konferenz)
Elektronische Ressource
Englisch
High Resolution Micromachining Using Short Wavelength and Short Pulse Lasers
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