To meet the critical reliability requirements of aerospace electronics, reliability design needs to be integrated into the early stage of product design process. In this paper the role of finite element analysis, thermodynamic calculation, and microstructural simulation in reliability design are introduced, followed by the discussion of failure oriented accelerated tests with emphasis on failure mechanisms. The typical failure mechanisms of three single loading tests as well as two combined thermal and mechanical loading tests are covered. Lastly, the challenges in reliability assessment and failure analysis of MEMS devices are discussed through two case studies, MEMS microphone and gyroscope.


    Zugriff

    Zugriff prüfen

    Verfügbarkeit in meiner Bibliothek prüfen

    Bestellung bei Subito €


    Exportieren, teilen und zitieren



    Titel :

    Improved methods for development of high reliability electronics


    Beteiligte:
    Li, Jue (Autor:in) / Dong, Hongqun (Autor:in) / Vuorinen, Vesa (Autor:in) / Karppinen, Juha (Autor:in) / Mattila, Toni T. (Autor:in) / Paulasto-Krockel, Mervi (Autor:in)

    Erschienen in:

    Erscheinungsdatum :

    01.03.2014


    Format / Umfang :

    2759909 byte




    Medientyp :

    Aufsatz (Konferenz)


    Format :

    Elektronische Ressource


    Sprache :

    Englisch



    Electronics reliability

    Brown, G.G. / Dennis, R.J. | Engineering Index Backfile | 1957


    Elastomers + Fluids + Electronics = Improved Comfort and Reliability for Aircraft

    Potter, J. L. / McGuire, D. P. / Brubaker, E. L. | British Library Conference Proceedings | 1995


    LEM electronics reliability.

    Friedenberg, J. B. / Landers, J. J. / Marcellos, P. | NTRS | 1966


    Reliability of electronics assemblies

    Hummel, J.E. | Tema Archiv | 1989


    Automotive electronics reliability handbook

    Society of Automotive Engineers, Electronics Reliability Subcommittee | TIBKAT | 1987