One way of achieving a low cost package is to adopt, as much as possible, the industry standard for electronic components and tailor it to fit MEMS sensors. In the following, we describe such a package example developed at Motorola. One of many MEMS sensor products from Motorola is a z-axis sensor. Under an inertial force, the middle movable plate deforms and yields a signal of capacitance change. A wafer-level package model (a half symmetry model to reveal the microcavity for the transducer) is developed. A 4-dot process only involves glue drops at four corners of the silicon. On the top of the silicon, a thin layer of silicone gel is dispensed and cured before the final step of placing epoxy-molding compound (EMC). A FEA model illustrates the final pacakage.


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    Titel :

    Packaging MEMS inertial sensors at Motorola


    Beteiligte:
    Li, G. (Autor:in) / Mahadevan, D. (Autor:in) / Chapman, M. (Autor:in)


    Erscheinungsdatum :

    01.01.2003


    Format / Umfang :

    236617 byte





    Medientyp :

    Aufsatz (Konferenz)


    Format :

    Elektronische Ressource


    Sprache :

    Englisch



    Packaging MEMS Inertial Sensors at Motorola

    IEEE | British Library Conference Proceedings | 2003


    Performance of MEMS Inertial Sensors

    Kourepenis, A. / Borenstein, J. / Connelly, J. et al. | British Library Conference Proceedings | 1998


    Performance of MEMS inertial sensors

    Kourepenis, A. / Borenstein, J. / Connelly, J. et al. | IEEE | 1998


    Performance of MEMS inertial sensors

    Kourepenis, A. / Borenstein, J. / Connelly, J. et al. | AIAA | 1998


    Performance of MEMS inertial sensors

    Kourepenis, A. / Borenstein, J. / Connelly, J. et al. | Tema Archiv | 1998