In this paper we focus on the heterogeneous integration of III-V opto-electronic devices and ultracompact SOI waveguides. The bonding coupling scheme of III-V and SOI is proposed. The first design is based on a thin film spin-on glass (SOG) adhesive bonding layer. Bonding layer thickness below 0.5 /spl mu/m have been presented. The second design is based on a thick film benzocyclobutene bonding (BCB). Bonding layer thickness above 1 /spl mu/m is readily achievable.


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    Titel :

    Heterogeneous integration of III-V membrane devices and ultracompact SOI waveguides


    Beteiligte:
    Roelkens, G. (Autor:in) / Vanthourhout, D. (Autor:in) / Baets, R. (Autor:in)


    Erscheinungsdatum :

    01.01.2004


    Format / Umfang :

    209622 byte





    Medientyp :

    Aufsatz (Konferenz)


    Format :

    Elektronische Ressource


    Sprache :

    Englisch




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