A new flip chip bonder for very high accuracy assembly of optoelectronic devices is described. Attention will be focussed on mechanical and thermal design and performance issues, with bonding results from a laser diode device.
Flip chip bonders for high end optoelectronic modules
01.01.1998
156596 byte
Aufsatz (Konferenz)
Elektronische Ressource
Englisch
Flip Chip Bonders for High End Opto-Electronic Modules
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