For space flight hardware, the thermal vacuum environmental test is the best test of a system's flight worthiness. Substituting an atmospheric pressure thermal test for a thermal/vacuum test can effectively reduce piece part temperatures by 20 C or more, even for low power density designs. Similar reductions in test effectiveness can also result from improper assembly level T/V test boundary conditions. The net result of these changes may reduce the effective test temperatures to the point where there is zero or negative margin over the flight thermal environment.
Thermal/Vacuum vs. Thermal Atmospheric Testing of Space Flight Electronic Assemblies
1990
13 pages
Report
Keine Angabe
Englisch
Semiconductor Devices , Laboratory & Test Facility Design & Operation , Space Technology , Semiconductor devices , Space environment simulation , Temperature effects , Thermal fatigue , Thermal vacuum tests , Atmospheric pressure , Environmental tests , Failure analysis , Thermal environments , Vacuum effects
Experience in thermal-vacuum testing earth satellites at goddard Space flight center
Engineering Index Backfile | 1963
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