Presented are the proceedings of the 10th Annual Soldering/Manufacturing Seminar, held on 19 and 20 February 1986 at the Naval Weapons Center, China Lake, CA. The proceedings include the papers or abstracts of papers presented at the Seminar and cover all aspects of soldering technology and electronics manufacturing.
Proceedings of the Annual Soldering/Manufacturing Seminar (10th) Held in China Lake, California on 19-20 February 1986
1986
197 pages
Report
Keine Angabe
Englisch
Manufacturing Processes & Materials Handling , Joining , Manufacturing, Planning, Processing & Control , Soldering , Electronics , Manufacturing , Soldering fluxes , Automation , Visual inspection , Defect analysis , Printed circuit boards , Soldered joints , Failure , Magnification , Symposia , Seminar , Proceedings , Component leads , Solder creams , Solder connection inspection , Statistical process control , Wire soldering , Wetting balance , FY86 , SBI1 , Technology