Engineering design guidelines enumerate and briefly describe selected adhesive properties. General review of polymeric types of adhesives is included and major types of commercially available adhesives specifically designed for microelectronic use are identified.


    Zugriff

    Zugriff über TIB

    Verfügbarkeit in meiner Bibliothek prüfen


    Exportieren, teilen und zitieren



    Titel :

    Organic adhesives for hybrid microcircuits


    Beteiligte:
    Perkins, K. L. (Autor:in) / Licari, J. J. (Autor:in)

    Erschienen in:

    Erscheinungsdatum :

    01.03.1976



    Medientyp :

    Sonstige


    Format :

    Keine Angabe


    Sprache :

    Englisch




    Sealing microcircuits with adhesives

    Licari, J. J. / Perkins, K. L. | NTRS | 1979


    Coatings for hybrid microcircuits

    Kinser, D. L. | NTRS | 1980



    Guidelines for fabrication of hybrid microcircuits

    Mckee, W. D., Jr. / Varga, J. E. / Brandewie, J. V. et al. | NTRS | 1972


    Microcircuits and resistors

    Emerald Group Publishing | 2007