Process, using fast-setting putty-type thixotropic epoxy material, eliminates need for leakproof enclosures. Method reduces cure time from 15 to 4 hours. Epoxy masters are stronger and do not require special coating for storage. Manufacturers of form-fitted insulation or packaging forms will find this process to be of interest.
Match-mold process for foam insulation
NASA Tech Briefs ; 3 , 1
01.06.1978
Sonstige
Keine Angabe
Englisch
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