Attachment for reciprocating power-saw maintains nearly constant cutting pressure even though kerf length varies. Attachment developed for wire saws used to slice cylindrical silicon ingots into wafers for semiconductor devices. By maintaining constant pressure, attachment helps to ensure smooth, flat, uniform wafers. Principle adaptable to straight, toothed saws as well as to wire saws.
Constant-Pressure Sawing
NASA Tech Briefs ; 9 , 3
01.01.1986
Sonstige
Keine Angabe
Englisch
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