Drilling of deep holes in silicon by laser beam aided by conducting operation in reactive atmosphere. Atmosphere reacts with material ejected from hole and converts material to gas flowing away from work area. Hole cleaner and more sharply defined, and debris do not spatter surface of work.
Laser Micromachining In A Reactive Atmosphere
NASA Tech Briefs ; 12 , 8
01.09.1988
Sonstige
Keine Angabe
Englisch
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