New process developed to produce aromatic condensation polyimide films and coatings having dielectric constants in range of 2.4 to 3.2. Materials better electrical insulators than state-of-the-art commercial polyimides. Several low-dielectric-constant polyimides have excellent resistance to moisture. Useful as film and coating materials for both industrial and aerospace applications where high electrical insulation, resistance to moisture, mechanical strength, and thermal stability required. Applicable to production of high-temperature and moisture-resistance adhesives, films, photoresists, and coatings. Electronic applications include printed-circuit boards, both of composite and flexible-film types and potential use in automotive, aerospace, and electronic industries.


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    Titel :

    Low-Dielectric Polyimides


    Beteiligte:

    Erschienen in:

    Erscheinungsdatum :

    01.01.1989



    Medientyp :

    Sonstige


    Format :

    Keine Angabe


    Sprache :

    Englisch


    Schlagwörter :


    Insoluble, Low-Dielectric-Constant Polyimides

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    Additives Lower Dielectric Constants Of Polyimides

    Stoakely, Diane M. / St. Clair, Anne K. / Emerson, Burt R., Jr. et al. | NTRS | 1990


    Aromatic Polyimides With Low Dielectric Constants

    St. Clair, Anne K. / St. Clair, Terry L. / Pratt, J. Richard | NTRS | 1994