The results of a study carried out in order to manufacture and verify the quality of chip-on-board (COB) packaging technology are presented. The COB, designed for space applications, was tested under environmental stresses, temperature cycling, and temperature-humidity-bias. Both robustness in space applications and in environmental protection on the ground-complete reliability without hermeticity were searched for. The epoxy-parylene combinations proved to be superior to other materials tested.


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    Titel :

    Fabrication and Qualification of Coated Chip-on-Board Technology for Miniaturized Space Systems


    Beteiligte:
    Maurer, R. H. (Autor:in) / Le, B. Q. (Autor:in) / Nhan, E. (Autor:in) / Lew, A. L. (Autor:in) / Darrin, M. Ann Garrison (Autor:in)

    Kongress:

    ESA Electronic Components Conference ; 1997 ; Noordwijk, Netherlands


    Erscheinungsdatum :

    01.07.1997


    Medientyp :

    Aufsatz (Konferenz)


    Format :

    Keine Angabe


    Sprache :

    Englisch




    Fabrication and Qualification of Coated Chip-on-Board Technology for Miniaturised Space Systems

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    Fabrication and Qualification of Coated Chip-on-Board Technology for Miniaturised Space Systems

    Maurer, R. H. / Garrison Darrin, M. A. / Le, B. Q. et al. | British Library Conference Proceedings | 1997



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