A study was made on the nature of the weld interface obtained in resistance welding of component leads used in electronic packages. To this end an investigation was made comparing the microstructure, microhardness, and microchemistry of a variety of cross wire resistance welds. Specifically, the investigation concerned itself with the variations in microhardness, and microchemistry at and near the weld interface as a function of metallographic structure, distance from the interface, and type of material being welded.This study will help answer such questions as the amount of diffusion of one weld component into another, the effects of welding on the mechanical properties near and adjacent to the weld, and provide for a more intelligent interpretation of the variety of microstructures that have been observed.The results of this work can be summarized as follows:


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    Titel :

    The Correlation of Microstructure, Microhardness, and Microchemistry in Resistance Welded Electronic Leads


    Weitere Titelangaben:

    Sae Technical Papers


    Beteiligte:
    Breen, J. E. (Autor:in) / Vahey, P. K. (Autor:in)

    Kongress:

    Electronic Packaging Conference ; 1965



    Erscheinungsdatum :

    01.02.1965




    Medientyp :

    Aufsatz (Konferenz)


    Format :

    Print


    Sprache :

    Englisch






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