Increased functionality, increased reliability and reduced system costs have been the driving forces behind silicon integration. However, conventional packaging options are becoming a barrier both technologically and in terms of cost effectiveness to further silicon integration. Multi-chip modules (MCMs) provide a cost effective solution to handling the most advanced of silicon chips while increasing reliability. An example of an automotive system which merits the use of thin film (MCM-D) technology is described. The preferred type of interconnect for this circuit together with the alternatives is discussed, with emphasis on the multi-chip module substrate.


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    Titel :

    Multi-Chip Modules for Automotive Applications


    Weitere Titelangaben:

    Sae Technical Papers


    Beteiligte:

    Kongress:

    Future Transportation Technology Conference & Exposition ; 1993



    Erscheinungsdatum :

    01.08.1993




    Medientyp :

    Aufsatz (Konferenz)


    Format :

    Print


    Sprache :

    Englisch




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