To support the requirement of concurrent engineering (CE), we need current STEP APs interpretable to integrate different applications in different phases of the entire lifetime cycle of a product. COMposition Application Protocols (COMAP) introduced and discussed in this paper is proposed to solve this problem. COMAP, serving as a root AP, is built on top of existing STEP APs for mapping information among them. A prototype of COMAP (cadpp) based on AP203 and AP224 for CAD/CAPP integration is implemented and discussed.


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    Titel :

    Composition application protocol for AP interoperability


    Beteiligte:
    Hou, Xiaolin (Autor:in) / Zhang, Shensheng (Autor:in)

    Kongress:

    Fourth International Conference on Computer-Aided Design and Computer Graphics ; 1995 ; Wuhan,China


    Erschienen in:

    Proc. SPIE ; 2644 ; 550


    Erscheinungsdatum :

    22.03.1996





    Medientyp :

    Aufsatz (Konferenz)


    Format :

    Elektronische Ressource


    Sprache :

    Englisch



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