The multiplicity of resin potting compound materials and the rationale for their use have been of concern to the Air Force for some time. High maintenance and support costs in the area of electronic repair are due in part to a proliferation of potting compounds and solvents. It appears that millions of dollars may be lost each year because of the difficulty of identifying and removing potting compounds from electronic assemblies. AFWAL/MLS, PRAM and WR-ALC have conducted two Electronic Module Potting Compound Surveys, sponsored the Air Force/Industry Repairable Potting Material Workshop, and revised MIL-STD-454J, requirement 47, to require the use of a transparent silicone potting compound material. The use of any other type of potting material will require the prior approval of AFWAL/MLSE. The workshop and survey results will be presented and discussed. The expected benefits from this standardization will be outlined.


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    Titel :

    A standardized potting material for electronic modules


    Weitere Titelangaben:

    Ein standardisiertes Einschlussmaterial fuer elektronische Module


    Beteiligte:
    Dobbs, B. (Autor:in) / Spinks, R.L. (Autor:in)


    Erscheinungsdatum :

    1985


    Format / Umfang :

    4 Seiten, 5 Bilder, 1 Tabelle, 2 Quellen


    Medientyp :

    Aufsatz (Konferenz)


    Format :

    Print


    Sprache :

    Englisch




    Hermeticite ou potting pour modules electroniques hybrides?

    Teytaud,C. / Gautier,J. / Forgeot,B. et al. | Kraftfahrwesen | 1986


    Potting procedure for electronic components

    Rubino, A. G. / Zimmerman, J. | NTRS | 1977




    Producibility of potting compounds

    Cruzan, J. S. | NTRS | 1964