The number of automotive applications requiring operation at higher temperature, above 150 deg C, is continuously increasing. We can distinguish three main drivers for this push towards higher temperature limits. First we see a need for more mechatronic-modules close to the mechanical part operating at high temperature, secondly we see an increasing number of applications operating under the hood near the engine and third the cost pressure requires higher integration level where logic, analogue and power stages are operating on the same silicon. This move to higher ambient temperature and especially higher junction temperature requires a good understanding of the limits and the impact on the quality and reliability of the device. AMIS started in Q2 2004 an HT-initiative program to investigate these limits and to enable new projects at higher temperatures, up to 200 deg C, full filling the required automotive quality and reliability. The HT-initiative covers simulation, modelling and qualification of our technologies up to 200 deg C, enables bonding and packaging for operation up to 200 deg C and installation of HT development flow including e.g. electro thermal simulations. This paper gives an overview of the limits encountered during the HT-initiative program and the realization of some projects within the new development flow.


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    Titel :

    Understanding the possibilities and limits for HT-applications. Subtitle: HT-initiative at AMI Semiconductor


    Beteiligte:


    Erscheinungsdatum :

    2007


    Format / Umfang :

    13 Seiten, 18 Bilder, 6 Quellen




    Medientyp :

    Aufsatz (Konferenz)


    Format :

    Print


    Sprache :

    Englisch




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