Hella experiences in leadfree production and product applications over more than 10 years show that the leadfree soldering technology is not an easy drop in solution for the existing leaded soldering standards The new solder process shows lower ability and higher thermal risk to the components. Solder joint reliability values are higher toleranced caused by complex metallization effects and worster wetting. The field of automotive electronics would be well advised to wait for the experiences and optimizations made in nonautomotive areas this time and in the next years (regarding ROMS) to approach the new technology with optimized leadfree designs and a mature supplier market.


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    Titel :

    Leadfree automotive electronics: Status, trends & first experience


    Beteiligte:
    Lange, P. (Autor:in) / Diekmann, J. (Autor:in) / Herenz, A. (Autor:in) / Seubert, T. (Autor:in)


    Erscheinungsdatum :

    2006


    Format / Umfang :

    7 Seiten, 8 Bilder, 3 Quellen



    Medientyp :

    Aufsatz (Konferenz)


    Format :

    Print


    Sprache :

    Englisch




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