Thermal shock and thermal cycle tests in the temperature range from -40 deg C to +150 deg C was performed to understand the joint reliability of Sn(3.5)Ag, Sn(0.7)Cu and Sn(5.0)Sb. For the thermal tests, the solder balls of the BGA test chips were fabricated using the materials. The chips are assembled to a daisy chain PCB. Thermal shock tests as well as thermal cycle tests were performed, and the resistance of the solder joints was monitored during the test. To analyze the failure, microstructure with respect to IMCs morphologies and thickness was analyzed and compared. The shear strength was also measured depending on the thermal cycles. A preliminary stress analyses was also conducted by numerical simulation. It was found that Sn(0.7)Cu exhibited superior mechanical properties among the investigated solder materials in the present test method.


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    Titel :

    Reliability evaluation of lead-free solders for automotive applications


    Beteiligte:
    Sa, Y.K. (Autor:in) / Kim, Yeong K. (Autor:in) / Bang, Junghwan (Autor:in) / Kim, Junki (Autor:in) / Yoo, Sehoon (Autor:in) / Lee, ChangWoo (Autor:in)


    Erscheinungsdatum :

    2009


    Format / Umfang :

    5 Seiten, 12 Bilder, 1 Tabelle, 3 Quellen



    Medientyp :

    Aufsatz (Konferenz)


    Format :

    Print


    Sprache :

    Englisch




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