This chapter contains sections titled: Introduction The Mechanism of Laser Induced Debonding (LID) Thin Film Patterning by Laser Induced Forward Transfer GaN Film Lift‐Off for High‐Brightness LEDs and High Power Electronics Dielectric Passivation Layer Opening for Interconnect Formation in Crystalline Silicon Solar Cells Laser Induced Wafer Debonding for Advanced Packaging Applications Summary


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    Titel :

    Laser Induced Thin Film Debonding for Micro‐Device Fabrication Applications


    Beteiligte:
    Mittal, K.L. (Herausgeber:in) / Lei, Wei‐Sheng (Herausgeber:in) / Lei, Wei‐Sheng (Autor:in) / Yu, Zhishui (Autor:in)

    Erschienen in:

    Erscheinungsdatum :

    02.02.2018


    Format / Umfang :

    26 pages




    Medientyp :

    Aufsatz/Kapitel (Buch)


    Format :

    Elektronische Ressource


    Sprache :

    Englisch




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