This chapter contains sections titled: Introduction The Mechanism of Laser Induced Debonding (LID) Thin Film Patterning by Laser Induced Forward Transfer GaN Film Lift‐Off for High‐Brightness LEDs and High Power Electronics Dielectric Passivation Layer Opening for Interconnect Formation in Crystalline Silicon Solar Cells Laser Induced Wafer Debonding for Advanced Packaging Applications Summary
Laser Induced Thin Film Debonding for Micro‐Device Fabrication Applications
Laser Technology ; 299-324
02.02.2018
26 pages
Aufsatz/Kapitel (Buch)
Elektronische Ressource
Englisch
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