In many MCM applications, data distribution from and to the memory chips that may reside on an MCM or on a adjacent board can become one of the key bottlenecks in high performance system implementation. This type of performance-limited data paths can be replaced by using an free-space optical interconnect (FSOI) module with crossbar connectivity between point to point interconnects. This system can be made into a standard data communication module for various applications (interconnect processors, DSP chips, memory and telecom interface circuits).


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    Title :

    High speed parallel multi-chip interconnection with free space optics


    Contributors:
    Xuezhe Zheng (author) / Marchand, P.J. (author) / Dawei Huang (author) / Esener, S.C. (author)


    Publication date :

    1999-01-01


    Size :

    207575 byte





    Type of media :

    Conference paper


    Type of material :

    Electronic Resource


    Language :

    English



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