In many MCM applications, data distribution from and to the memory chips that may reside on an MCM or on a adjacent board can become one of the key bottlenecks in high performance system implementation. This type of performance-limited data paths can be replaced by using an free-space optical interconnect (FSOI) module with crossbar connectivity between point to point interconnects. This system can be made into a standard data communication module for various applications (interconnect processors, DSP chips, memory and telecom interface circuits).


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    Titel :

    High speed parallel multi-chip interconnection with free space optics


    Beteiligte:
    Xuezhe Zheng (Autor:in) / Marchand, P.J. (Autor:in) / Dawei Huang (Autor:in) / Esener, S.C. (Autor:in)


    Erscheinungsdatum :

    01.01.1999


    Format / Umfang :

    207575 byte





    Medientyp :

    Aufsatz (Konferenz)


    Format :

    Elektronische Ressource


    Sprache :

    Englisch



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