Improved process for fabrication of integrated circuits developed. Technique utilizes simultaneous ion-beam sputter etching and carbon sputter deposition in conjunction with carbon sputter mask or organic mask decomposed to produce carbon-rich sputter-mask surface. Sputter etching process replenishes sputter mask with carbon to prevent premature mask loss.


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    Title :

    Masking Technique for Ion-Beam Sputter Etching


    Contributors:

    Published in:

    Publication date :

    1986-05-01



    Type of media :

    Miscellaneous


    Type of material :

    No indication


    Language :

    English




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