The 472 Dimpled Ball Grid Array (D-BGA) package has not been used in past space flight environments, therefore it is necessary to determine the robustness and reliability of the solder joints. The 472 D-BGA packages passed the above environmental tests within the specifications and are now qualified for use on space flight electronics.
Dimpled Ball Grid Array process development for space flight applications
2001 IEEE Aerospace Conference
2000-10-19
Conference paper
No indication
English