The 472 Dimpled Ball Grid Array (D-BGA) package has not been used in past space flight environments, therefore it is necessary to determine the robustness and reliability of the solder joints. The 472 D-BGA packages passed the above environmental tests within the specifications and are now qualified for use on space flight electronics.


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    Title :

    Dimpled Ball Grid Array process development for space flight applications


    Contributors:
    Barr, S. L. (author) / Mehta, A. (author)

    Conference:

    2001 IEEE Aerospace Conference


    Publication date :

    2000-10-19


    Type of media :

    Conference paper


    Type of material :

    No indication


    Language :

    English