None given. From Background section: JPL, in partnership with an industrial consortium, is engaged in the investigation of reliability and quality issues of ball grid array (BGA) packages for space flight electronics applications.


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    Title :

    Qualification of Ball Grid Array Assemblies for Space Flight Applications


    Contributors:
    Bonner, K. (author) / Walton, S. (author)

    Publication date :

    1997-02-09


    Type of media :

    Preprint


    Type of material :

    No indication


    Language :

    English