A method of monitoring the health of selected solder joints, called SJ-BIST, has been developed by Ridgetop Group Inc. under a Small Business Innovative Research (SBIR) contract. The primary goal of this research program is to test and validate this method in a flight environment using realistically seeded faults in selected solder joints. An additional objective is to gather environmental data for future development of physics-based and data-driven prognostics algorithms. A test board is being designed using a Xilinx FPGA. These boards will be tested both in flight and on the ground using a shaker table and an altitude chamber.


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    Title :

    Solder Joint Health Monitoring Testbed


    Contributors:

    Conference:

    NASA ARMD/Aviation Safety Technical Conference ; 2009 ; McLean, VA, United States
    Military/Aerospace Programmable Logic Device 2009 (MAPLD 2009) ; 2009 ; Greenbelt, MD, United States


    Publication date :

    2009-08-31


    Type of media :

    Miscellaneous


    Type of material :

    No indication


    Language :

    English






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