A method of monitoring the health of selected solder joints, called SJ-BIST, has been developed by Ridgetop Group Inc. under a Small Business Innovative Research (SBIR) contract. The primary goal of this research program is to test and validate this method in a flight environment using realistically seeded faults in selected solder joints. An additional objective is to gather environmental data for future development of physics-based and data-driven prognostics algorithms. A test board is being designed using a Xilinx FPGA. These boards will be tested both in flight and on the ground using a shaker table and an altitude chamber.


    Zugriff

    Zugriff über TIB

    Verfügbarkeit in meiner Bibliothek prüfen


    Exportieren, teilen und zitieren



    Titel :

    Solder Joint Health Monitoring Testbed


    Beteiligte:
    Delaney, Michael M. (Autor:in) / Flynn, James (Autor:in) / Browder, Mark (Autor:in)

    Kongress:

    NASA ARMD/Aviation Safety Technical Conference ; 2009 ; McLean, VA, United States
    Military/Aerospace Programmable Logic Device 2009 (MAPLD 2009) ; 2009 ; Greenbelt, MD, United States


    Erscheinungsdatum :

    31.08.2009


    Medientyp :

    Sonstige


    Format :

    Keine Angabe


    Sprache :

    Englisch


    Schlagwörter :



    Pico Satellite Solar Cell Testbed (PSSC Testbed)

    E. J. Simburger / S. Liu / J. S. Halpine et al. | NTIS | 2007


    Pico Satellite Solar Cell Testbed (PSSC Testbed)

    E. J. Simburger / S. Liu / J. Halpine et al. | NTIS | 2005


    Exploration Systems Health Management Facilities and Testbed Workshop

    Wilson, Scott / Waterman, Robert / McCleskey, Carey | NTRS | 2004