A laminated light guide and component carrier (10, 54, 64, 72, 92, 96, 96') includes a polymeric material body (12) having a first face (14). A light emitting diode (20, 20', 20", 20"', 20"", 22) is positioned on the first face (14). A connector (28) is positioned on the first face(14). A through aperture (24, 24', 24", 24"', 24"", 26) is created in the body (12) positioned proximate to the light emitting diode (20, 20', 20", 20"', 20"", 22). A light guide (48, 56, 66, 74) of a light transmissive polymeric material is overmolded onto the first face (14) proximate to and covering the light emitting diode (20, 20', 20", 20"', 20"", 22) and filling the through aperture, and omitted from the space envelope containing the connector. An opaque polymeric material coating layer (62, 80, 114) is affixed onto the first face (14) outside of the light guide (48, 56, 66, 74, 98, 108).


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    Titel :

    MULTIPLE RESIN OVER-MOLD FOR PRINTED CIRCUIT BOARD ELECTRONICS AND LIGHT GUIDE


    Weitere Titelangaben:

    MEHRFACHHARZUMSPRITZUNG FÜR LEITERPLATTENELEKTRONIK UND LICHTLEITER
    SURMOULAGE DE RÉSINE MULTIPLE POUR ÉLECTRONIQUE DE CARTE DE CIRCUIT IMPRIMÉ ET GUIDE DE LUMIÈRE


    Beteiligte:

    Erscheinungsdatum :

    13.11.2019


    Medientyp :

    Patent


    Format :

    Elektronische Ressource


    Sprache :

    Englisch


    Klassifikation :

    IPC:    H05K PRINTED CIRCUITS , Gedruckte Schaltungen / B29C Formen oder Verbinden von Kunststoffen , SHAPING OR JOINING OF PLASTICS / B60Q ARRANGEMENT OF SIGNALLING OR LIGHTING DEVICES, THE MOUNTING OR SUPPORTING THEREOF OR CIRCUITS THEREFOR, FOR VEHICLES IN GENERAL , Anordnung von Signal- oder Beleuchtungsvorrichtungen, deren Einbau oder Halterung oder deren Schaltkreise bei Fahrzeugen allgemein



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