A laminated light guide and component carrier includes a polymeric material body having a first face. A light emitting diode is positioned on the first face. A connector is positioned on the first face. A through aperture is created in the body positioned proximate to the light emitting diode. A light guide of a light transmissive polymeric material is overmolded onto the first face proximate to and covering the light emitting diode and filling the through aperture, and omitted from the space envelope containing the connector. An opaque polymeric material coating layer is affixed onto the first face outside of the light guide.


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    Titel :

    Multiple resin over-mold for printed circuit board electronics and light guide


    Beteiligte:

    Erscheinungsdatum :

    23.06.2020


    Medientyp :

    Patent


    Format :

    Elektronische Ressource


    Sprache :

    Englisch


    Klassifikation :

    IPC:    F21V FUNCTIONAL FEATURES OR DETAILS OF LIGHTING DEVICES OR SYSTEMS THEREOF , Funktionsmerkmale oder Einzelheiten von Leuchten oder Beleuchtungssystemen / F21S Ortsfeste Leuchten , NON-PORTABLE LIGHTING DEVICES / H05K PRINTED CIRCUITS , Gedruckte Schaltungen / B60Q ARRANGEMENT OF SIGNALLING OR LIGHTING DEVICES, THE MOUNTING OR SUPPORTING THEREOF OR CIRCUITS THEREFOR, FOR VEHICLES IN GENERAL , Anordnung von Signal- oder Beleuchtungsvorrichtungen, deren Einbau oder Halterung oder deren Schaltkreise bei Fahrzeugen allgemein



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