A high-current element for high-current printed circuit boards is formed from at least two metal sheets which are connected to form a sheet-metal stack and which have a plurality of pins at least at an end region thereof, and wherein the sheet-metal stack has a terminal region, a pin region, and a connection region, and wherein the metal sheets are connected to one another in the connection region, and the pins are arranged in the pin region and formed for contacting with the high-current printed circuit board, and the terminal region is set up to be used as a terminal region for connecting the high-current element to external power terminals.


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    Titel :

    HIGH-CURRENT ELEMENT FOR HIGH-CURRENT PRINTED CIRCUIT BOARDS


    Beteiligte:
    SPERBER MICHAEL (Autor:in) / EWALD AKE (Autor:in) / HAZARIKA CHANDRA GUPTA (Autor:in)

    Erscheinungsdatum :

    25.01.2024


    Medientyp :

    Patent


    Format :

    Elektronische Ressource


    Sprache :

    Englisch


    Klassifikation :

    IPC:    H05K PRINTED CIRCUITS , Gedruckte Schaltungen / B60R Fahrzeuge, Fahrzeugausstattung oder Fahrzeugteile, soweit nicht anderweitig vorgesehen , VEHICLES, VEHICLE FITTINGS, OR VEHICLE PARTS, NOT OTHERWISE PROVIDED FOR / H01R Elektrisch leitende Verbindungen , ELECTRICALLY-CONDUCTIVE CONNECTIONS



    POLYIMIDE PRINTED CIRCUIT BOARDS

    SAE Technical Papers | 1979


    High Voltage Stress-Lifetime Study of Insulated Printed Circuit Boards

    Korashy, Oliver / Gollor, Matthias / Franke, Andreas | IEEE | 2023


    High-energy electron-induced discharges in printed circuit boards

    Wenaas, E.P. / Treadaway, M.J. / Flanagan, T.M. et al. | Tema Archiv | 1979


    High performance heat sink for double sided printed circuit boards

    LAPUJADE PHILIPPE / BARTELS ANTHONY / HESSLING VON HEIMENDAHL ANDRE | Europäisches Patentamt | 2021

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