Summary form only given. We have demonstrated an 8x8 VCSEL array flip-chip bonded to a dummy silicon chip that mimics the real CMOS driver IC by using Al metal lines and contact pads. All the bonded devices operated reliably, showing only a small variation in wavelength, threshold current and power output across the array. This demonstrates the suitability of this bonding technique for the integration of VCSEL arrays with high speed Si-based CMOS driver ICs.


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    Titel :

    Flip-chip bonding of VCSEL arrays with silicon driver chips for high speed data links


    Beteiligte:
    Koelle, U. (Autor:in) / Johnson, S.R. (Autor:in) / Kelkar, P. (Autor:in) / Turpin, R. (Autor:in) / Dowd, P. (Autor:in) / Pan, G. (Autor:in) / Zhang, Y.-H. (Autor:in)


    Erscheinungsdatum :

    01.01.1998


    Format / Umfang :

    256788 byte




    Medientyp :

    Aufsatz (Konferenz)


    Format :

    Elektronische Ressource


    Sprache :

    Englisch



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