Electronic systems, such as power supplies, are complex multilayered devices consisting of different materials with inherent variability. Thermal gradient cycling occurs during system operation which eventually results in thermo-mechanical fatigue induced material failure. Such material failures can result in immediate electronic system shutdown with no advanced fault or warning signals. This NAVAIR sponsored SBIR project uses state-of-the-art material modeling to predict degradation of circuit board elements as a means for "simulated fault detection". This effort has been focused on the specific aspect of solder fracture and fatigue since electronic industry statistics have attributed this failure issue as a driving factor in system reliability. This project demonstrates feasibility for using conventional sensing, combined with thermal modeling, to predict solder degradation due to thermal cycling as a means to prognosticate electronic power supply system reliability. Current status, as well as future plans, of electronic prognosis development is discussed.


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    Titel :

    Electronics reliability prognosis through material modeling and simulation


    Beteiligte:
    Nasser, L. (Autor:in) / Curtin, M. (Autor:in)

    Erschienen in:

    Erscheinungsdatum :

    01.01.2006


    Format / Umfang :

    2048435 byte




    Medientyp :

    Aufsatz (Konferenz)


    Format :

    Elektronische Ressource


    Sprache :

    Englisch



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