Quick visual inspection identifies out-of-place layers. Small copper pads or other labels on layers present regular pattern if multilayer circuit board properly assembled and irregular pattern if one or more layers in wrong place. New method faster, cheaper, and more reliable than earlier methods.
Edge Labels for Multilayer Circuit Boards
NASA Tech Briefs ; 8 , 4
01.04.1985
Sonstige
Keine Angabe
Englisch
Effective electromagnetic shielding in multilayer printed circuit boards
Tema Archiv | 1981
|Fabrication of Multilayer Ceramic Interconnection Boards
SAE Technical Papers | 1971
|NTRS | 1986