This paper reviews the physics-of-failure model for accelerated thermal cycle tests of solder joints associated with various electronics components, summarizes the parameters of the automotive environment, and discusses the methods for developing thermal cycle tests for reliability validation for automotive electronics. The paper proposes an approach to develop the requirements for validation tests based on the customer usage profiles and the desired product life goal. This requirement determines the nominal testing duration based on the equivalent damage generated from the worst-case field applications.


    Zugriff

    Zugriff prüfen

    Verfügbarkeit in meiner Bibliothek prüfen

    Bestellung bei Subito €


    Exportieren, teilen und zitieren



    Titel :

    Correlation of Thermal Cycle Tests to Field Usage Profiles for Solder Joints in Automotive Electronics


    Weitere Titelangaben:

    Sae Technical Papers


    Beteiligte:

    Kongress:

    International Congress & Exposition ; 1998



    Erscheinungsdatum :

    23.02.1998




    Medientyp :

    Aufsatz (Konferenz)


    Format :

    Print


    Sprache :

    Englisch


    Schlagwörter :


    Correlation of thermal cycles tests to field usage profile for solder joints in automotive electronics

    Hu,J.M. / Garfinkel,G.A. / Visteon Automotive Systems,US | Kraftfahrwesen | 1998


    Correlation of Thermal Cycles Tests to Field Usage Profile for Solder Joints in Automotive Electronics

    Hu, J. M. / Garfinkel, G. A. / Society of Automotive Engineers | British Library Conference Proceedings | 1998


    Lead Free Solder for Automotive Electronics

    Whitten, Gordon | SAE Technical Papers | 1998



    Lead free solder for automotive electronics

    Whitten,G. / Delphi Delco Electronics Systems,US | Kraftfahrwesen | 1998