The design methodology for reliable electronic packaging for automotive electronic applications is discussed. Sources of reliability problems are also discussed. Examples are given to illustrate the features of several key interconnects in hybrid, thick-film devices in which material selection and design are critical. Some examples of reliable design models are given.


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    Titel :

    Electronic packaging reliability in automotive applications


    Weitere Titelangaben:

    Zuverlässigkeit elektronischer Packungsdichten bei automativen Anwendungen


    Beteiligte:

    Erschienen in:

    Erscheinungsdatum :

    1989


    Format / Umfang :

    5 Seiten


    Medientyp :

    Aufsatz (Konferenz)


    Format :

    Print


    Sprache :

    Englisch




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